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Applications

VarioEdit™

• Backside circuit edit/debug
• As an adjunct to FIB
• Deposition of metal lines and pads
• Dielectric deposition
• 3-D micromachining of semiconductor and biomaterial devices

VarioMetric™

• Thick & Thin Film Metrology
• SOI Wafer Metrology
• Flip Chip Metrology
• Thickness Measurements on Plastics and other Scattering Samples
• Metrology of Rough Surfaced Materials
• Thickness Measurements of Bonded Wafers:
  • Si-Glass
  • Si-Si
  • Si-Epoxy
  • Quartz and Other Crystals
• Optical End-Pointing for Closed Loop Control During Wafer Grinding and Lapping
• Trench Depth and Via Hole Measurements
• Stacked Die
• MEMS Metrology
• In-line Metrology