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Applications
VarioEdit™
Backside circuit edit/debug
As an adjunct to FIB
Deposition of metal lines and pads
Dielectric deposition
3-D micromachining of semiconductor and biomaterial devices
VarioMetric™
Thick & Thin Film Metrology
SOI Wafer Metrology
Flip Chip Metrology
Thickness Measurements on Plastics and other Scattering Samples
Metrology of Rough Surfaced Materials
Thickness Measurements of Bonded Wafers:
Si-Glass
Si-Si
Si-Epoxy
Quartz and Other Crystals
Optical End-Pointing for Closed Loop Control During Wafer Grinding and Lapping
Trench Depth and Via Hole Measurements
Stacked Die
MEMS Metrology
In-line Metrology